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Session Speakers
Session Description
5G, Edge, Open RAN and AI all have tremendous potential to transform every level of government. For the U.S. Government, multiple departments, agencies, and personnel recognize that for us to continue leading the world on next generation technology, it is necessary to facilitate a healthy collaboration among technology suppliers, commercial stakeholders, other government agencies, and regulatory bodies.
The Government, Homeland Security & Defense Summit at MWC Las Vegas is a two-day educational program that brings together officials from the U.S. Dept. of Defense, NTIA (Dept. of Commerce), the White House, Federal Communications Commission (FCC) and other Agencies deeply involved in the development of Next Generation mobile networks: 5G, 6G and beyond.
This series of sessions is designed to provide a strategic view of the U.S. Government’s leadership in 5G, 6G, open networks, spectrum sharing and more.
This summit also offers a timely and important opportunity for the commercial mobile sector to meet with Federal officials to better understand their needs and vision for deploying complex and high-bandwidth mobile communications. Attendees will also gain insight into computing solutions for a wide variety of applications at military and government facilities worldwide.
10:00am to 10:20am - Sponsor Presentation
Chris Melus, Vice President of Product Management, T-Mobile for Business
10:20am to 10:45am - Summit Keynote
10:45am to 11:15am - Strategies for Commercialization of 6G
6G is set to redefine the digital landscape. 6G is expected enable new services such as holographic communication, precision agriculture, autonomous vehicles, and the Internet of Everything (IoE). In this panel, invited speakers will discuss not just technology initiatives for 6G, but how they can or should enable new markets through joint sensing and communications networks, co-existence between 5G and new waveforms, and more.
Diane Rinaldo, Director, Open RAN Policy Coalition
Brian Daly, Assistant Vice President, Standards & Industry Alliances, NextG Alliance
Ray Dolan, CEO, Cohere Technologies
Mari Silbey, National Spectrum Consortium
11:15am to 11:45am - Updates on the Public Wireless Supply Chain Innovation Fund
The Biden-Harris Administration will advance Open RAN through the $1.5 billion Public Wireless Supply Chain Innovation Fund. Over the next decade, the Innovation Fund will drive wireless innovation, competition, and supply chain resilience. Its investments will open new doors for companies from the United States and partner nations. The second Notice of Funding Opportunity (NOFO) in the Public Wireless Supply Chain Innovation Fund will make up to $420 million available to invest in projects that will drive commercialization and innovation in open radio units. Attend this session for an update and what to expect in the future from NTIA.
Lauristan Hardin, Chief Technical Advisor, NTIA
11:45am to 12:30pm - Lessons Learned from Early POC: 5G Architecture for Test and Training
Hear from specialists deploying secure and reliable communications from housing to drill areas and beyond. Understand the neutral host model and how it applies to any organization, military, commercial and government. The panel will discuss the deployments, insights gleaned and common best practices.
Jacob Lamb, Electronic Warfare Branch Chief, US Army
Stephen Booher, Director, Booz Allen Hamilton
Jen Congdon, Director, Booz Allen Hamilton (Moderator)
12:30pm to 1:30pm - Opportunities to Participate in Dept. of Defense Microelectronics Commons Program
This session details the Microelectronics Commons program within the US Dept. of Defense, which creates a direct pathway to reduce the country’s reliance on foreign microelectronics and safeguard the nation from supply chain risks. Funded by the CHIPS and Science Act, the Microelectronics Commons program is a network of regional technology Hubs acting on a shared mission: to expand the nation’s global leadership in microelectronics. Through this program, the Microelectronics Commons program is accelerating domestic prototyping and growing a pipeline of U.S.-based semiconductor talent. The program comprises eight regional Hubs, each managing its network of commercial innovators. This session provides details of the Program and discusses how commercial interest who are interested in contributing their capabilities in support of the Microelectronics Commons program can participate.
Eric Makara, Microelectronics Commons 5G/6G Technical Execution Area Lead
Head, Systems Integration & Instrumentation Section, Naval Research Laboratory
1:30pm - Day Two Summit Concludes